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home >> products >> Semiconductor material >> Quartz wafers >> SAW Grade LT Wafer

SAW Grade LiTaO3(LT) Wafer

 

Orientation

360rot.Y-cut±0.20

420rot.Y-cut±0.20

Y-cut±0.20

Diameter

76.2±0.3mm
100.0±0.3mm

76.2±0.3mm
100.0±0.3mm

76.2±0.3mm
100.0±0.3mm

Orientation Flat (OF)

22±2mm
32±2mm
Perpendicular to X±20

22±2mm
32±2mm
Perpendicular to X±20

22±2mm
32±2mm
Perpendicular to Z±20

Second Ref. Flat (RF)

10±3mm
Cw2700±0.50 from OF

10±3mm
Cw3150±0.50 from OF

10±3mm
Cw2250±0.50 from OF

Thickness

500±20μm
350±20μm

Propagating Surface

“+” side
RA≤8Å

Wafer Backside

GC#1000 lapped & etched
0.2μm≤Ra≤0.7μm

TTV

≤10μm

LTV

≤2.0μm within an area of 5X5 mm2

PLTV

≥95% (3mm from edge excluded)

BOW

-25μm≤Bow≤+25μm

Curie Temperature

605±3oC(DTA method)

Edge Beveling

Edge Rounding

 

 

* SAW Device