Diameter

76.2±0.3mm

Orientation Flat (OF)

22±2mm
Perpendicular to X±20

Second Ref. Flat (RF)

10±3mm
Cw1800±0.50 from OF
Cw2700±0.50 from OF

Thickness

500±5μm
1000±5μm

Surface Quality

Double Sides Polished
S/D 20/10

Wafer Backside

GC#1000 lapped & etched
0.2μm≤Ra≤0.7μm

TTV

≤6μm

WARP

≤20μm

Concentration

4.9~6mol%

Refraction Index

605±0.7oC(DTA method)

Edge Beveling

Edge Rounding