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Silicon NTC FREDs

NEDITEK’s NTC (Negative Temperature Coefficient) Fast Recovery Epitaxial Diodes adopt negative temperature coefficient design, achieving low high-temperature loss and stable efficiency for high-temperature operating power conversion systems.

Features

  • Low high-temperature power dissipation
  • Ultra-fast soft recovery performance
  • Excellent high-temperature long-term stability
  • Negative temperature coefficient voltage characteristics

Applications

  • High-temperature industrial power converters
  • EV & thermal harsh-environment power modules
  • High-frequency inverter circuits
  • Aerospace high-temperature power electronics
Part
Number
IFAV
(A)
VRRM
(V)
IR_Max@VR
(µA)
IFSM
(A)
Trra_Max
(ns)
Trra_Typ
(ns)
Trrb_Typ
(ns)
VF_Max@IF
(V)
VF_Typ@IF
(V)
Dimensions
(µm × µm)
Dimensions
(mil)
NDGY010012
1
2002202015150.9
0.85
0.87
0.82
1035*103540
NDGY010026
3
2002602515190.975
0.875
0.91
0.85
1490*149058
NDGY010038
4
2002802516200.975
0.875
0.91
0.85
1690*169066
NDGY010048
4
2002802516200.975
0.875
0.91
0.85
2270*227089
NDGY0100510
5
20021002518220.975
0.875
0.91
0.85
1840*184072
NDGY010061520021503520240.9750.912190*219086
NDGY010071520021502518221.050.962190*219086
NDGY010082020022003021251.050.982390*273094*107
NDGY010092020022003021251.050.952390*273094*107
NDGY010102020022003022261.050.982680*2680105
NDGY010112520022503023271.050.982830*2830111
NDGY010123520023503527311.050.983340*3340131
NDGY010134020024004030341.050.984030*4030158
NDGY01014100200510007055451.050.985460*5460215
NDGY0101553002502519231.31.31690*169066
NDGY01016830028015131021.71840*184072
NDGY010171030021002519231.31.12190*219086
NDGY010182530022504031271.20.953430*3430135
NDGY010193030023004032281.20.954030*4030158
NDGY010203030023003529251.31.054030*4030158
NDGY010214530054505540351.214800*4800189
NDGY010228030058006050441.31.15460*5460215
NDGY0102354002503022261.31.121380*138053
NDGY0102454002503022261.31.11500*150059
NDGY0102584002803024281.31.151640*164064
NDGY010261040021003527241.31.122030*203080
NDGY010271040021003025221.31.151840*184072
NDGY010281540021503527241.351.152230*223088
NDGY0102920
10
40022003022191.6
1.35
1.33
1.13
3030*3030119
NDGY010304040054004031271.351.153000*5400118*212
NDGY010314040054004031271.451.24000*4000157
NDGY010326040056005542361.451.255460*5460215
NDGY0103375400107508070451.351.16600*6600260
NDGY0103446002403525211.551.31420*142056
NDGY0103556002503526221.551.31550*155061
NDGY010368
4
6002803527231.55
1.45
1.3
1.18
1830*183072
NDGY01037860010802515152.31.91830*183072
NDGY01038860010802516162.31.92030*203080
NDGY0103986002803527231.551.32030*203080
NDGY010401060021003527231.551.32230*223088
NDGY0104110600101002517172.31.92230*223088
NDGY0104210600101003022201.81.552190*219088
NDGY0104312600101203528241.61.32600*2600102
NDGY010441560021504028251.551.33030*3030119
NDGY0104515600101503024212.31.93030*3030119
NDGY010462060022004535301.61.33400*3400134
NDGY010472060022004535301.61.32800*3800110*150
NDGY010483060023005037321.551.33300*5200130*205
NDGY010493060023005037321.61.33300*5200130*205
NDGY0105030600103004029242.31.93300*5200130*205
NDGY010514060054006048431.551.34030*5530158*218
NDGY0105260600106007560351.451.255800*5800228
NDGY0105360600106006553321.81.555800*5800228
NDGY0105460600106007058352.31.95800*5800228
NDGY0105575600107508570381.451.256600*6600260
NDGY0105675600107507560341.81.556600*6600260
NDGY0105710060020100011075601.451.259800*6500386*256
NDGY0105826502203525211.81.41150*115045
NDGY0105946502403525231.81.51420*142059*59
NDGY0106086502803527231.81.51830*183072
NDGY0106186502803527231.81.452000*200079*79
NDGY010621065021003527241.81.42230*223088
NDGY010631065021003527241.81.452200*220087
NDGY010641265021203528241.81.552600*2600102
NDGY010651565021504028251.81.553030*3030119
NDGY010661565051504028251.81.553000*3000118*118
NDGY010672065052004535301.81.43400*3400134*134
NDGY0106830650230070551.551.33300*5200130*205
NDGY010693065023005542331.81.553300*5200130*205
NDGY010703065053005542331.81.553300*5200130*205
NDGY010714065054006550451.81.554000*5500157*216
NDGY0107250650550075551.81.555000*5000197
NDGY0107360650106008565381.551.35800*5800228
NDGY0107460650106008058351.81.555800*5800228
NDGY0107560650560085651.551.355800*5800229*229
NDGY010766065056008058351.81.455800*5800229*229
NDGY0107775650107509075421.551.36600*6600260
NDGY0107875650107508565381.81.556600*6600260
NDGY010797565057508565381.81.556580*6580259
NDGY0108010065020100011077631.551.39800*6500386*256
NDGY0108110065020100010075601.81.559800*6500386*256
NDGY01082150650201500150100601.81.559000*9000354
NDGY01083880028045292821.72030*203080
NDGY010843010001030055382632.53130*6530123*257
NDGY01085612002604533292.422200*220087
NDGY01086812002805038282.422480*248098
NDGY01087812002804026233.32.82480*248098
NDGY0108810120021005540302.41.92700*2700103
NDGY0108915120021506048322.523430*3430135
NDGY0109015120021505033283.3283430*3430135
NDGY0109120120022007050342.423030*5030119*198
NDGY01092201200102005536303.32.83030*5030119*198
NDGY01093301200103007557362.423130*6530123*257
NDGY01094301200103006045323.32.83130*6530123*257
NDGY01095401200104008570602.423700*6500146*256
NDGY01096501200105009080702.425000*6000197*236
NDGY010976012001060010078452.425130*7130202*281
NDGY01098601200106008568363.32.85130*7130202*281
NDGY010997512001075012088802.426500*6500256
NDGY011001001200201000150115602.429800*6500386*256
NDGY0110115012002015002001302.429240*9240364
NDGY0110215012002015002001302.4211300*7300118
NDGY0110320012002020002501801102.4212000*12000472
NDGY0110420012002020002501802.41.912100*8700476*343
NDGY01105751700207501501102.82.36818*6818268
NDGY0110610017002010002001602.82.37632*7632300
NDGY0110715017002015002502102.82.39000*9000354
Silicon NTC FREDs(images 1)

IDM

Full IDM capability covering epitaxy, wafer, packaging,
ensuring stable supply and consistent performance.

Silicon NTC FREDs(images 2)

Integration

Proprietary Si/GaAs/GaN technologies, with products spanning DC to
100 GHz for high-power, high-efficiency applications.

Silicon NTC FREDs(images 3)

More Reliable

Strong customization and system-level design, providing
one-stop solutions from bare die to SIP & microsystems.

Silicon NTC FREDs(images 4)

IDM

Full IDM capability covering epitaxy, wafer, packaging,
ensuring stable supply and consistent performance.

Silicon NTC FREDs(images 5)

Integration

Proprietary Si/GaAs/GaN technologies, with products spanning DC to
100 GHz for high-power, high-efficiency applications.

Silicon NTC FREDs(images 6)

More Reliable

Strong customization and system-level design, providing
one-stop solutions from bare die to SIP & microsystems.

RF & mm Wave Design Engineers

Pursue ultra-low parasitics & signal integrity for 100 GHz+ applications.

Test Instrument Architects

Need ultra-stable, low-noise RF components for precision test & measurement systems.

Power Electronics Designers

Seek high-efficiency SiC/Si devices for EV & industrial power systems.

Optoelectronics R&D Teams

Need high-performance OLED microdisplays & photodetectors for AR/VR & night vision.

RF & mm Wave Design Engineers

Pursue ultra-low parasitics & signal integrity for 100 GHz+ applications.

Test Instrument Architects

Need ultra-stable, low-noise RF components for precision test & measurement systems.

Power Electronics Designers

Seek high-efficiency SiC/Si devices for EV & industrial power systems.

Optoelectronics R&D Teams

Need high-performance OLED microdisplays & photodetectors for AR/VR & night vision.

Storage & Environment

Store in N2 cabinets/Gel-Pak; operate in Class 10,000 cleanroom.

ESD Precautions

ESD sensitive; grounded wrist straps and workstations required.

Handling & Pick-up

No metal tweezers on chip body; use vacuum tools or ESD-safe plastic tweezers on leads only.

Assembly & Bonding

Thermocompression: Stage 150℃ / Tool 250℃; precise force control.

Storage & Environment

Store in N2 cabinets/Gel-Pak; operate in Class 10,000 cleanroom.

ESD Precautions

ESD sensitive; grounded wrist straps and workstations required.

Handling & Pick-up

No metal tweezers on chip body; use vacuum tools or ESD-safe plastic tweezers on leads only.

Assembly & Bonding

Thermocompression: Stage 150℃ / Tool 250℃; precise force control.

Construction & Compliance

Parts & Materials /
Composition

Built with Precision, Engineered for Performance.” NEDITEK’s GaAs/GaN RF/mmWave chips feature optimized material architectures: GaAs devices deliver stable 100 GHz+ performance via gold metallization, semi-insulating GaAs substrates, and silicon nitride/glass passivation;

Silicon NTC FREDs(images 7)
Silicon NTC FREDs(images 8)
Silicon NTC FREDs(images 9)
Silicon NTC FREDs(images 10)

Pre-sales: Accelerating Your Design

Silicon NTC FREDs(images 11)
Silicon NTC FREDs(images 12)

After-sales: Quality & Supply Assurance

Silicon NTC FREDs(images 13)

Pre-sales: Accelerating Your Design

Silicon NTC FREDs(images 14)

After-sales: Quality & Supply Assurance

01 How does NEDITEK ensure consistent quality across diverse product portfolios (including RF/mmWave, power electronics, and OLED microdisplay devices)?

NEDITEK employs a unified, high-standard quality management system (QMS) tailored to semiconductor manufacturing, covering silicon-based ICs, GaAs/GaN RF devices, power electronics (SiC/Silicon), and OLED microdisplays. We implement strict process control and traceability systems across the entire IDM chain—from epitaxy and wafer fabrication to metallization, packaging, and final testing. By standardizing core processes and leveraging automated inspection platforms, we guarantee consistent performance, reliability, and dimensional accuracy across all product categories, meeting the stringent requirements and consumer applications.

02 What quality and reliability standards do NEDITEK’s products comply with to support mission-critical and industrial applications?

All NEDITEK products, including power semiconductors (SiC/GaN MOSFETs/SBDs) and multi-functional silicon ICs, comply with widely recognized international industry standards and high-grade quality requirements for demanding applications. We perform comprehensive reliability validation customized for each product category: power devices are tested under high-temperature reverse bias (HTRB), high-humidity conditions, and dynamic stress to ensure high efficiency and long-term operational stability; silicon-based multi-functional chips are verified for wide environmental adaptability and consistent signal performance. Adherence to ISO, IATF, and industrial-grade quality standards ensures reliable performance in harsh industrial, automotive, and high-reliability commercial environments.

03 How does NEDITEK maintain manufacturing precision and yield for high-value products?

NEDITEK maintains exceptional manufacturing precision and high, stable yields for high-value products including RF devices, power semiconductors, silicon-based multi-functional ICs and OLED microdisplays. We operate in strictly controlled cleanroom environments, implement real-time statistical process control, conduct full-process in-line testing and full-lifecycle traceability, and apply AI-driven quality optimization to minimize variations, eliminate defects, and ensure consistent performance across every batch.

04 What advanced testing and failure analysis (FA) capabilities does NEDITEK have to support product development and customer projects?

NEDITEK has built a comprehensive testing & FA laboratory covering all product lines. We provide full electrical parameter testing (including S-parameters, power characteristics, and display performance), environmental stress testing (temperature cycling, vibration, radiation), and advanced failure analysis (scanning electron microscopy, X-ray inspection, thermal analysis). Our professional engineering team delivers detailed FA reports and corrective action plans, helping customers quickly resolve design-in and manufacturing issues—accelerating R&D iteration and ensuring product robustness.

05 How does NEDITEK ensure supply chain stability and quality traceability for high-volume, long-cycle projects across all product categories?

As a vertical IDM manufacturer, NEDITEK controls the entire supply chain from substrate procurement to final production, eliminating third-party dependency risks. We implement end-to-end traceability systems for every batch of wafers, components, and finished products, enabling full lifecycle tracking. For high-volume and long-cycle projects, we maintain buffer stock planning, PCN/EOL lifecycle management, and flexible production scheduling. This ensures uninterrupted supply, on-time delivery, and consistent quality across silicon, RF, power electronics, and microdisplay product lines.

06 What process optimizations does NEDITEK apply to balance performance, miniaturization, and reliability?

NEDITEK leverages proprietary process integration technologies to optimize performance, size, and reliability. We adopt advanced packaging solutions (such as SIP and system-level integration) for multi-functional chips to reduce footprint while enhancing signal processing efficiency; for power devices, we optimize SiC wafer processes and thermal management designs to achieve high power density, low loss, and excellent heat dissipation. These optimizations ensure our power products meet the strict size, efficiency, and reliability requirements of compact industrial systems, automotive electronics, and other high quality platforms.

Manufacturing Excellence & Quality Assurance

Silicon NTC FREDs(images 15)

Manufacturing Excellence & Quality Assurance

Silicon NTC FREDs(images 16)
01 How does NEDITEK ensure consistent quality across diverse product portfolios (including RF/mmWave, power electronics, and OLED microdisplay devices)?

NEDITEK employs a unified, high-standard quality management system (QMS) tailored to semiconductor manufacturing, covering silicon-based ICs, GaAs/GaN RF devices, power electronics (SiC/Silicon), and OLED microdisplays. We implement strict process control and traceability systems across the entire IDM chain—from epitaxy and wafer fabrication to metallization, packaging, and final testing. By standardizing core processes and leveraging automated inspection platforms, we guarantee consistent performance, reliability, and dimensional accuracy across all product categories, meeting the stringent requirements and consumer applications.

02 What quality and reliability standards do NEDITEK’s products comply with to support mission-critical and industrial applications?

All NEDITEK products, including power semiconductors (SiC/GaN MOSFETs/SBDs) and multi-functional silicon ICs, comply with widely recognized international industry standards and high-grade quality requirements for demanding applications. We perform comprehensive reliability validation customized for each product category: power devices are tested under high-temperature reverse bias (HTRB), high-humidity conditions, and dynamic stress to ensure high efficiency and long-term operational stability; silicon-based multi-functional chips are verified for wide environmental adaptability and consistent signal performance. Adherence to ISO, IATF, and industrial-grade quality standards ensures reliable performance in harsh industrial, automotive, and high-reliability commercial environments.

03 How does NEDITEK maintain manufacturing precision and yield for high-value products?

NEDITEK maintains exceptional manufacturing precision and high, stable yields for high-value products including RF devices, power semiconductors, silicon-based multi-functional ICs and OLED microdisplays. We operate in strictly controlled cleanroom environments, implement real-time statistical process control, conduct full-process in-line testing and full-lifecycle traceability, and apply AI-driven quality optimization to minimize variations, eliminate defects, and ensure consistent performance across every batch.

04 What advanced testing and failure analysis (FA) capabilities does NEDITEK have to support product development and customer projects?

NEDITEK has built a comprehensive testing & FA laboratory covering all product lines. We provide full electrical parameter testing (including S-parameters, power characteristics, and display performance), environmental stress testing (temperature cycling, vibration, radiation), and advanced failure analysis (scanning electron microscopy, X-ray inspection, thermal analysis). Our professional engineering team delivers detailed FA reports and corrective action plans, helping customers quickly resolve design-in and manufacturing issues—accelerating R&D iteration and ensuring product robustness.

05 How does NEDITEK ensure supply chain stability and quality traceability for high-volume, long-cycle projects across all product categories?

As a vertical IDM manufacturer, NEDITEK controls the entire supply chain from substrate procurement to final production, eliminating third-party dependency risks. We implement end-to-end traceability systems for every batch of wafers, components, and finished products, enabling full lifecycle tracking. For high-volume and long-cycle projects, we maintain buffer stock planning, PCN/EOL lifecycle management, and flexible production scheduling. This ensures uninterrupted supply, on-time delivery, and consistent quality across silicon, RF, power electronics, and microdisplay product lines.

06 What process optimizations does NEDITEK apply to balance performance, miniaturization, and reliability?

NEDITEK leverages proprietary process integration technologies to optimize performance, size, and reliability. We adopt advanced packaging solutions (such as SIP and system-level integration) for multi-functional chips to reduce footprint while enhancing signal processing efficiency; for power devices, we optimize SiC wafer processes and thermal management designs to achieve high power density, low loss, and excellent heat dissipation. These optimizations ensure our power products meet the strict size, efficiency, and reliability requirements of compact industrial systems, automotive electronics, and other high quality platforms.

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Silicon NTC FREDs(images 17)
Silicon NTC FREDs(images 18)

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